--- title: Teleconnect Blog | Collin Contentai description: Collin is a digital creative writer and illustrator, specializing in content generation for B2B marketing. His content is created by AI and reviewed by a human before posting. --- [![Logo_TC_2](https://www.teleconnect.de/hubfs/Logo_TC_2.svg "Logo_TC_2")](https://www.teleconnect.de/?hsLang=en) - [Services](https://www.teleconnect.de/en/services) - Hardware Engineering - [Hardware Development](https://www.teleconnect.de/en/services/hardware-development) - [FPGA Design](https://www.teleconnect.de/en/leistungsangebot/fpga-design) - [PCB Design](https://www.teleconnect.de/en/services/pcb-design) - [Firmware Development](https://www.teleconnect.de/en/services/firmwaredevelopment) - [Optical Conformity Tests](https://www.teleconnect.de/en/services/optical-conformity-tests) - [Reference Designs](https://www.teleconnect.de/leistungsangebot/referenzdesigns) - [Products](https://www.teleconnect.de/en/product-overview) - [Startup Support](https://www.teleconnect.de/en/for-start-ups) - [Teleconnect](https://www.teleconnect.de/en/company) - [History](https://www.teleconnect.de/en/teleconnect/history) - [Quality and Sustainability](https://www.teleconnect.de/en/teleconnect/quality-and-sustainability) - [Venture Studio by Teleconnect](https://www.teleconnect.de/en/teleconnect/venture-studio) - [Learning Center](https://www.teleconnect.de/en/learning) - [Blog](https://www.teleconnect.de/en/blog) - [Technologies](https://www.teleconnect.de/en/learning/technologies) - [Single Pair Ethernet](https://www.teleconnect.de/en/technologies/spe) - [EtherCAT](https://www.teleconnect.de/en/learning/technologies/ethercat) - [HD-PLC](https://www.teleconnect.de/en/learning/technologies/hd-plc) - [G.HN](https://www.teleconnect.de/en/learning/technologies/g.hn) - [DSL](https://www.teleconnect.de/en/learning/technologies/dsl) - [FTTx](https://www.teleconnect.de/en/learning/technologies/fttx) - [LiFi](https://www.teleconnect.de/en/learning/technologies/lifi) - [References](https://www.teleconnect.de/en/learning/reference-projects) - [Publications](https://www.teleconnect.de/en/publications) - [Research](https://www.teleconnect.de/en/learning/research-funding) - [Pricing](https://www.teleconnect.de/en/learning/pricing-and-costs) - [Career](https://www.teleconnect.de/en/jobs-career) - [Contact](https://www.teleconnect.de/en/contact) English - [English](https://www.teleconnect.de/en/blog/author/collin-contentai) - [Deutsch](https://www.teleconnect.de/blog/author/collin-contentai) [![Logo_TC_2](https://www.teleconnect.de/hubfs/Logo_TC_2.svg "Logo_TC_2")](https://www.teleconnect.de/?hsLang=en) [![Logo_TC_2](https://www.teleconnect.de/hubfs/Logo_TC_2.svg "Logo_TC_2")](https://www.teleconnect.de/?hsLang=en) - [Services](https://www.teleconnect.de/en/services) - Hardware Engineering - [Hardware Development](https://www.teleconnect.de/en/services/hardware-development) - [FPGA Design](https://www.teleconnect.de/en/leistungsangebot/fpga-design) - [PCB Design](https://www.teleconnect.de/en/services/pcb-design) - [Firmware Development](https://www.teleconnect.de/en/services/firmwaredevelopment) - [Optical Conformity Tests](https://www.teleconnect.de/en/services/optical-conformity-tests) - [Reference Designs](https://www.teleconnect.de/leistungsangebot/referenzdesigns) - [Products](https://www.teleconnect.de/en/product-overview) - [Startup Support](https://www.teleconnect.de/en/for-start-ups) - [Teleconnect](https://www.teleconnect.de/en/company) - [History](https://www.teleconnect.de/en/teleconnect/history) - [Quality and Sustainability](https://www.teleconnect.de/en/teleconnect/quality-and-sustainability) - [Venture Studio by Teleconnect](https://www.teleconnect.de/en/teleconnect/venture-studio) - [Learning Center](https://www.teleconnect.de/en/learning) - [Blog](https://www.teleconnect.de/en/blog) - [Technologies](https://www.teleconnect.de/en/learning/technologies) - [Single Pair Ethernet](https://www.teleconnect.de/en/technologies/spe) - [EtherCAT](https://www.teleconnect.de/en/learning/technologies/ethercat) - [HD-PLC](https://www.teleconnect.de/en/learning/technologies/hd-plc) - [G.HN](https://www.teleconnect.de/en/learning/technologies/g.hn) - [DSL](https://www.teleconnect.de/en/learning/technologies/dsl) - [FTTx](https://www.teleconnect.de/en/learning/technologies/fttx) - [LiFi](https://www.teleconnect.de/en/learning/technologies/lifi) - [References](https://www.teleconnect.de/en/learning/reference-projects) - [Publications](https://www.teleconnect.de/en/publications) - [Research](https://www.teleconnect.de/en/learning/research-funding) - [Pricing](https://www.teleconnect.de/en/learning/pricing-and-costs) - [Career](https://www.teleconnect.de/en/jobs-career) - [Contact](https://www.teleconnect.de/en/contact) English - [English](https://www.teleconnect.de/en/blog/author/collin-contentai) - [Deutsch](https://www.teleconnect.de/blog/author/collin-contentai) [![Logo_TC_2](https://www.teleconnect.de/hubfs/Logo_TC_2.svg "Logo_TC_2")](https://www.teleconnect.de/?hsLang=en) - [Services](https://www.teleconnect.de/en/services) - Hardware Engineering - [Hardware Development](https://www.teleconnect.de/en/services/hardware-development) - [FPGA Design](https://www.teleconnect.de/en/leistungsangebot/fpga-design) - [PCB Design](https://www.teleconnect.de/en/services/pcb-design) - [Firmware Development](https://www.teleconnect.de/en/services/firmwaredevelopment) - [Optical Conformity Tests](https://www.teleconnect.de/en/services/optical-conformity-tests) - [Reference Designs](https://www.teleconnect.de/leistungsangebot/referenzdesigns) - [Products](https://www.teleconnect.de/en/product-overview) - [Startup Support](https://www.teleconnect.de/en/for-start-ups) - [Teleconnect](https://www.teleconnect.de/en/company) - [History](https://www.teleconnect.de/en/teleconnect/history) - [Quality and Sustainability](https://www.teleconnect.de/en/teleconnect/quality-and-sustainability) - [Venture Studio by Teleconnect](https://www.teleconnect.de/en/teleconnect/venture-studio) - [Learning Center](https://www.teleconnect.de/en/learning) - [Blog](https://www.teleconnect.de/en/blog) - [Technologies](https://www.teleconnect.de/en/learning/technologies) - [Single Pair Ethernet](https://www.teleconnect.de/en/technologies/spe) - [EtherCAT](https://www.teleconnect.de/en/learning/technologies/ethercat) - [HD-PLC](https://www.teleconnect.de/en/learning/technologies/hd-plc) - [G.HN](https://www.teleconnect.de/en/learning/technologies/g.hn) - [DSL](https://www.teleconnect.de/en/learning/technologies/dsl) - [FTTx](https://www.teleconnect.de/en/learning/technologies/fttx) - [LiFi](https://www.teleconnect.de/en/learning/technologies/lifi) - [References](https://www.teleconnect.de/en/learning/reference-projects) - [Publications](https://www.teleconnect.de/en/publications) - [Research](https://www.teleconnect.de/en/learning/research-funding) - [Pricing](https://www.teleconnect.de/en/learning/pricing-and-costs) - [Career](https://www.teleconnect.de/en/jobs-career) - [Contact](https://www.teleconnect.de/en/contact) Current language: English - [English](https://www.teleconnect.de/en/blog/author/collin-contentai) - [Deutsch](https://www.teleconnect.de/blog/author/collin-contentai) # Teleconnect Blog [Product Development](https://www.teleconnect.de/en/blog/tag/product-development) [Single Pair Ethernet (SPE)](https://www.teleconnect.de/en/blog/tag/single-pair-ethernet-spe) [Management](https://www.teleconnect.de/en/blog/tag/management) [Culture](https://www.teleconnect.de/en/blog/tag/culture) [Compute](https://www.teleconnect.de/en/blog/tag/compute) [Fiber Communications](https://www.teleconnect.de/en/blog/tag/fiber-communications) [Module](https://www.teleconnect.de/en/blog/tag/module) [SOM](https://www.teleconnect.de/en/blog/tag/som) [Security](https://www.teleconnect.de/en/blog/tag/security) [EtherCAT](https://www.teleconnect.de/en/blog/tag/ethercat) [Nessum](https://www.teleconnect.de/en/blog/tag/nessum) [![](https://www.teleconnect.de/hubfs/Projektmanagement%20Hardwareentwicklung.jpg)](https://www.teleconnect.de/en/blog/warum-kommunikationshardware-projekte-sich-verzögern-durchlaufzeit-nicht-nur-abstimmung) [Management](https://www.teleconnect.de/en/blog/tag/management) [Product Development](https://www.teleconnect.de/en/blog/tag/product-development) 23 Min Read ### [Why Communication Hardware Projects Run Late: Lead Time, Not Just Alignment](https://www.teleconnect.de/en/blog/warum-kommunikationshardware-projekte-sich-verzögern-durchlaufzeit-nicht-nur-abstimmung) Your project review's delay causes were measured on hardware — by one of four research communities, and not ... [![Picture of Collin Contentai](https://www.teleconnect.de/hubfs/Authors/LABEL_AI_black%20transparent.png) Collin Contentai Aug 10, 2026, 4:48:04 PM](https://www.teleconnect.de/en/blog/author/collin-contentai) [![](https://www.teleconnect.de/hubfs/Background/Produkt%20Entwicklung%20in%20der%20Daten%C3%BCbertragung.jpg)](https://www.teleconnect.de/en/blog/carrier-board-design-für-lötbare-module-footprint-reflow-und-thermik) [Compute](https://www.teleconnect.de/en/blog/tag/compute) [Module](https://www.teleconnect.de/en/blog/tag/module) [SOM](https://www.teleconnect.de/en/blog/tag/som) 27 Min Read ### [Carrier Board Design for Solderable Modules: Footprint, Reflow, and Thermal Considerations](https://www.teleconnect.de/en/blog/carrier-board-design-für-lötbare-module-footprint-reflow-und-thermik) A practical guide to the carrier board for solder-down OSM modules: footprint per IPC-7093A, solder paste ... [![Picture of Collin Contentai](https://www.teleconnect.de/hubfs/Authors/LABEL_AI_black%20transparent.png) Collin Contentai Jul 29, 2026, 6:16:49 PM](https://www.teleconnect.de/en/blog/author/collin-contentai) [![](https://www.teleconnect.de/hubfs/Background/Produkt%20Entwicklung%20in%20der%20Daten%C3%BCbertragung.jpg)](https://www.teleconnect.de/en/blog/osm-module-mit-i.mx-91-i.mx-93-13-module-im-vergleich-2026) [Compute](https://www.teleconnect.de/en/blog/tag/compute) [Module](https://www.teleconnect.de/en/blog/tag/module) [SOM](https://www.teleconnect.de/en/blog/tag/som) 17 Min Read ### [OSM Modules with i.MX 91 & i.MX 93: A Comparison of 13 Modules (2026)](https://www.teleconnect.de/en/blog/osm-module-mit-i.mx-91-i.mx-93-13-module-im-vergleich-2026) 13 solder-down OSM modules based on NXP i.MX 91 and i.MX 93 from 9 vendors compared — silicon, documentation, ... [![Picture of Collin Contentai](https://www.teleconnect.de/hubfs/Authors/LABEL_AI_black%20transparent.png) Collin Contentai Jul 29, 2026, 5:59:33 PM](https://www.teleconnect.de/en/blog/author/collin-contentai) [![](https://www.teleconnect.de/hubfs/Projektmanagement%20Hardwareentwicklung.jpg)](https://www.teleconnect.de/en/blog/more-than-layout-solving-pcb-design-bottlenecks-with-a-strategic-partner) [Product Development](https://www.teleconnect.de/en/blog/tag/product-development) 7 Min Read ### [More Than Layout: Solving PCB Design Bottlenecks with a Strategic Partner](https://www.teleconnect.de/en/blog/more-than-layout-solving-pcb-design-bottlenecks-with-a-strategic-partner) Have you ever watched a promising hardware project grind to a halt because a single PCB layout expert wasn’t ... [![Picture of Collin Contentai](https://www.teleconnect.de/hubfs/Authors/LABEL_AI_black%20transparent.png) Collin Contentai Jul 28, 2025, 6:50:46 PM](https://www.teleconnect.de/en/blog/author/collin-contentai) - [Imprint](https://www.teleconnect.de/en/imprint) - [Privacy Policy](https://www.teleconnect.de/en/privacy-policy) - [Legal Notice](https://www.teleconnect.de/en/legal-notice) ![ISO_9001_colour_en](https://www.teleconnect.de/hs-fs/hubfs/Certificates/ISO_9001_colour_en.jpg?width=200&height=100&name=ISO_9001_colour_en.jpg "ISO_9001_colour_en") [Follow us on LinkedIn](https://www.linkedin.com/company/teleconnect-gmbh/) [Follow us on Xing](https://www.xing.com/pages/teleconnectgmbh) [Check us out on Kununu](https://www.kununu.com/de/teleconnect1) ```json { "@context" : "https://schema.org", "@id" : "https://www.teleconnect.de#org", "@type" : "Organization", "description" : "As a spin-off of the Institute of Communications Engineering, Teleconnect GmbH is today an engineering office and service provider for contract development of complete product developments from the idea to the production transition and series support for the wired and optical transmission and the associated signal processing at (DSL, G.hn, PON and LiFi). We handle all technical issues, from concept and feasibility studies to the start of mass production. Our customers are renowned, international companies in the electronics industry in the fields of telecommunications, data transmission, automation technology, automotive electronics and medical technology. Our services are turnkey electronics development, hardware design and testing, embedded software development, industrial design, FPGA programming and much more. We are ready to perform a turnkey project or to perform individual tasks for you.", "email" : "info@teleconnect.de", "logo" : "https://www.teleconnect.de/hs-fs/hubfs/Logos/35%20Years%20teleconnect-1.png", "name" : "Teleconnect GmbH", "telephone" : "+49 (351) 4236-210", "url" : "https://www.teleconnect.de/", "vatID" : "DE140301522" } ```