Carrier Board Design for Solderable Modules: Footprint, Reflow, and Thermal Considerations
A practical guide to the carrier board for solder-down OSM modules: footprint per IPC-7093A, solder paste ...
Teleconnect Blog
OSM Modules with i.MX 91 & i.MX 93: A Comparison of 13 Modules (2026)
13 solder-down OSM modules based on NXP i.MX 91 and i.MX 93 from 9 vendors compared — silicon, documentation, ...
Building Reliable Systems — Without Losing Control
At Teleconnect, we keep embedded systems simple, cost-driven, and understandable.
More Than Layout: Solving PCB Design Bottlenecks with a Strategic Partner
Have you ever watched a promising hardware project grind to a halt because a single PCB layout expert wasn’t ...
Powering the Future: How Single Pair Ethernet (SPE) Transforms Solar Energy Systems
The global drive towards renewable energy has significantly positioned solar power at the forefront of ...
Price trends in telecommunications, data transmission and automation technology
Effects on hardware development The rapid technological advances in the fields of telecommunications, data ...
Nessum (formerly HD-PLC) Deep Dive
Nessum (formerly HD-PLC) is a versatile communication technology standardized as IEEE 1901-2020, designed to ...
Single-Pair Ethernet (SPE) in Building Automation
Single-Pair Ethernet (SPE) represents an emerging networking technology that holds considerable potential for ...
Single-Pair Ethernet: The Foundation of Next-Generation Industrial IoT
In a modern chemical processing plant, thousands of sensors continuously monitor critical parameters—pressure ...
The role of Single Pair Ethernet in IoT development
What is Single Pair Ethernet and why is it relevant? Single Pair Ethernet (SPE) is a new Ethernet technology ...