PCB design
Our development team
Highly complex layouts for highly complex requirements
Our many years of experience in PCB design enable us to offer you the best quality and functionality for highly complex layouts. Multilayer, microvias, high-density PCBs, backplanes, the use of BGAs with more than 1000 pins, impedance-controlled and EMC-compliant design are more than just "familiar material" for our team.
We take care of the entire design process, from the creation of circuit diagrams and parts lists to PCB design and data preparation for PCB production and component manufacture.
Our development cycle
- Import project construction library
- Limit the installation space (set up dimensions and blocked areas)
- Determine and set up layer structure
- Check circuit diagram and correct if necessary
- Check test points in the circuit diagram
- Add to library if necessary
- Rough placement in function groups
- Placing test points
- Apply Design for Manufacturing (DfM) methods
- Optimise rough concept for routing
- Equalise lengths
- Route differential pairs
- Calculate impedances
- Connection to power planes
- Observe EMC guidelines
- Drilling and Gerber data
- Placement print
- Step models (3D) if necessary
- documentation
Our development tools
Ausgehend von den erzeugten MENTOR-Daten ist eine 3D-Darstellung der bestückten Leiterplatte möglich. Dazu nutzen wir die Funktion von Solid Works, unserem Tool für mechanische Konstruktion.
Die Teleconnect GmbH ist Mitglied im Fachverband Elektronikdesign und -fertigung e. V. (FED) für:
- Branchen-Networking
- Austausch mit Fachexperten
- Nutzen des Schulungsangebot
- Zugang zu Arbeitskreisen und Projektgruppen
- Diskussion und Weiterbildung in der Regionalgruppe Dresden