Teleconnect offers hardware development services for electronics and embedded systems, including PCB layout, to help you succeed in the global market by integrating cutting-edge technologies into your products. Our engineers are experienced in working with various processor architectures, interfaces, and memory types. In addition, our team has access to world-class microprocessors and electronic components from industry leaders such as TI, Marvell, ST, Fujitsu, Analog Devices, Intel, Broadcom, NXP and others. We keep up to date with the latest trends in the industry to provide you with the best cost-quality ratio for your solution.

Our services in detail

Solution approach and specification:

• Feasibility studies taking into account the latest technologies and component developments
• Development of specifications based on relevant international standards
• Cost estimates

Circuit design, simulation and unbundling, among others, by means of

Electronics  //  Workbench  // MathCAD  // MATLAB  //  MENTOR Graphics  //
Cadence  //  Orcad  // FilterCAD  //  QSICOS  //  DuSLICOS

Component procurement:

• Cooperation with the distributor of your choice
• Direct contact with well-known semiconductor manufacturers

Prototype production and commissioning:

• Test setups, test circuits
• Laboratory assembly of modules in small quantities
• Very good connections to well-known EMS service providers (Electronic Manufacturing Service)

EMC and climate testing:

• Analysis of the operating conditions and derivation or definition of the EMC standards to be applied, preparation of a test plan
• EMC measurements during development in our own shielding cabin
  - Burst up to 4 kV
  - ESD up to 8 kV contact/15 kV air
  - Surge up to 6 kV 1.2/50 µs or 10/700 µs
  - Conducted disturbances 0.15 - 80 MHz up to 20 V
  - Mains power contact up to 16 A
  - Conducted interference emission 0.15 - 30 MHz
  - RF emission near field 30 MHz - 26 GHz
  - RF-immission near field 10 MHz - 7 GHz
• Standard-compliant tests at certified EMC laboratories
  (EX: SLG Prüf- und Zertifizierungs GmbH Hartmannsdorf, Pro EVM, Dr. Rasek)
• Evaluation of EMC test results, preparation of test reports, if necessary search for solutions or preparation of proposals for modifications in case of non-compliance with required parameters.
• Climatic tests up to test specimen size 550 x 500 x 640 mm3 in the temperature range from -40 °C to +180 °C at relative humidity from 10 % to 98 % (larger at +10 °C to +70 °C by arrangement)

DoCumentation:
Circuit descriptions, test specifications, test protocols, installation instructions, operating manuals optionally in German, English or Russian using MS Office, FrameMaker, PDF-Writer